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IPC 6013 CHINESE : B

IPC 6013 CHINESE : B

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

Available format(s)

Hardcopy

Withdrawn date

09-01-2017

Language(s)

Chinese

Publisher

Institute of Printed Circuits

DevelopmentNote
Also available in CD-ROM format. (11/2011)
DocumentType
Standard
Pages
60
PublisherName
Institute of Printed Circuits
Status
Withdrawn
SupersededBy

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
SAE AMS 2424 : 2010 PLATING, NICKEL LOW-STRESSED DEPOSIT
IPC 4552 : 0 PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS
IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 4202 : A FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC 4203 : A COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
IPC 4563 : 0 RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE
ASME B46.1 : 2009 SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY)
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC 4811 : 0 SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2251 : 0 DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
SAE AMS QQ A 250 B : 2012 ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR
IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IPC 4204 : A FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC 4781 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK
NEMA LI 1 : 1998(R2011) INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS
IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
IPC 2223 : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

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Hardcopy - Chinese

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