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IPC-2226A:2017

Current

Current

The latest, up-to-date edition.

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

Available format(s)

Hardcopy

Language(s)

English

Published date

01-09-2017

This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.

DocumentType
Standard
ISBN
978-1-61193-324-6
Pages
48
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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US$256.20
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