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BS EN 60191-6:2009

BS EN 60191-6:2009

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Available format(s)

Hardcopy , PDF

Superseded date

10-31-2022

Language(s)

English

Published date

04-30-2010

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms and definitions
4 Design rules
5 Dimensions to be specified
6 Notes
Annex A (informative) - Illustration of the rules
Annex B (informative) - Optional table format
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides general rules for the preparation of outline drawings of surface-mounted semiconductor devices.

Committee
EPL/47
DevelopmentNote
Supersedes BS 3934-6(1992) (02/2005) Supersedes 07/30167960 DC. (04/2010)
DocumentType
Standard
Pages
42
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical revision. This edition includes the following significant changes with respect to the previous edition:
a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;
b) editorial modifications on several pages; and
c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.

Standards Relationship
NBN EN 60191-6 : 2010 Identical
I.S. EN 60191-6:2009 Identical
IEC 60191-6:2009 Identical
NF EN 60191-6 : 2011 Identical
EN 61755-2-2 : 2006 Identical
DIN EN 60191-6:2010-06 Identical
EN 60191-6:2009 Identical

IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
ISO 2692:2014 Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR)
EN ISO 1101:2017 Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2017)
ISO 1101:2017 Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN ISO 2692:2014 Geometrical product specifications (GPS) - Geometrical tolerancing - Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) (ISO 2692:2014)
IEC 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

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PDF - English
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