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PD IEC/TR 60068-3-12:2007

PD IEC/TR 60068-3-12:2007

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Environmental testing Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

Available format(s)

Hardcopy , PDF

Superseded date

17-10-2014

Language(s)

English

Published date

30-04-2007

Publisher

British Standards Institution

Committee
EPL/501
DocumentType
Standard
Pages
20
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

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Hardcopy - English
PDF - English

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