OVE EN IEC 60749-20:2023 08 01
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Available format(s)
Hardcopy
Language(s)
English, German
Published date
01-08-2023
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
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