![header thumbnail](/images/publishers\ipc_cover.gif)
IPC A 20/21 : 1996
Current
Current
The latest, up-to-date edition.
![header thumbnail](/images/publishers\ipc_cover.gif)
STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
Available format(s)
Hardcopy
Language(s)
English
Published date
01-02-1996
Publisher
These Gerber electronic files include patterns for development of solder paste stencils by laser or chemical etching. Gives land widths of 0.4 mm, 0.63 mm and 1.25 mm so as to evaluate solder paste slump. J STD 005 is included with each order.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.