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IEC PAS 62169:2000
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
07-04-2009
English
22-08-2000
1 Foreword
2 Purpose
3 Scope
3.1 Packages
3.2 Assembly process
3.3 Reliability
4 Applicable documents
4.1 EIA JEDEC/Institute for Interconnecting and
Packaging Electronic Circuits (IPC) & Joint
Industry Standards
4.2 Electronic Industries Alliance (EIA, JEDEC)
4.3 Department of Defense
4.4 American Society for testing and Materials (ASTM)
5 Terms and definitions
6 Dry packing
6.1 Requirements
6.2 Drying of components before being sealed in MBBs
6.3 Dry pack
7 Drying
7.1 Post exposure to factory ambient
7.2 General considerations for baking
8 Use
8.1 Incoming bag inspection
8.2 Floor life
8.3 Safe storage
8.4 Reflow
8.5 Drying indicators
8.6 Board rework
9 Derating due to factory environmental conditions
Tables
Figures
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