IEC 60191-6-12:2002
Superseded
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Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English, Spanish, Castilian
14-06-2002
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
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