SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD

Published date

22-11-2012

Publisher

Ente Nazionale Italiano di Unificazione (UNI)

Foreword
1 Scope
2 Normative references
3 Symbols
4 Principle
5 Reagents
6 Apparatus and materials
7 Test specimens
8 Procedure
9 Expression of results
10 Precision
11 Test report
Annex A (informative) - Method for the preparation
        of standard reference rosin (colophony) based
        liquid fluxes, having 25% by mass non-volatile
        content
Annex B (informative) - Chemical composition of brass
        test plates
Bibliography

This part of ISO 9455 specifies a method for the determination of the efficacy of a soft soldering flux.

DocumentType	Test Method
PublisherName	Ente Nazionale Italiano di Unificazione (UNI)
Status	Current
Supersedes	UNI EN ISO 9455-10 : 2001

Standards	Relationship
SN EN ISO 9455-10 : 2012	Identical
I.S. EN ISO 9455-10:2012	Identical
NF EN ISO 9455-10 : 2012	Identical
NS EN ISO 9455-10 : 2012	Identical
BS EN ISO 9455-10:2012	Identical
NEN EN ISO 9455-10 : 2012	Identical
DIN EN ISO 9455-10:2013-01	Identical
UNE-EN ISO 9455-10:2012	Identical
NBN EN ISO 9455-10 : 2012	Identical
EN ISO 9455-10:2012	Identical
ISO 9455-10:2012	Identical

ISO 197-1:1983	Copper and copper alloys Terms and definitions Part 1: Materials
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
ISO 9455-16:2013	Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
ISO 3611:2010	Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics
ISO 9453:2014	Soft solder alloys Chemical compositions and forms