Customer Support: 131 242

  • There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

NF EN ISO 9455-17 : 2006

Current

Current

The latest, up-to-date edition.

SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

Published date

12-01-2013

Avant-propos
1 Domaine d'application
2 Références normatives
3 Principe
4 Réactifs
5 Appareillage
6 Controle des coupons d'essai
7 Préparation des échantillons
8 Mode opératoire
9 Évaluation
10 Précision
11 Rapport d'essai
Annexe A (informative) Lignes directrices sur l'essai
         de RIS
Annexe B (informative) Essai au peigne et essai de
         migration électrochimique de résistance
         d'isolement de surface des résidus de
         flux - Rapport d'essai de qualification
Bibliographie

Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.

DevelopmentNote
Indice de classement: A81-365-17 PR NF EN ISO 9455-17 March 2006 (03/2006)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Current

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Need help?
Call us on 131 242, then click here to start a Screen Sharing session
so we can help right away! Learn more