MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS

Superseded date

14-09-2023

Published date

16-12-2021

Publisher

Institute of Printed Circuits

1 FOREWORD
2 INTRODUCTION
3 SCOPE
4 TERMS AND DEFINITIONS
5 SYMBOLS AND ABBREVIATED TERMS
6 SAMPLING
7 APPARATUS
  7.1 Universal Tester
  7.2 Strain Measurement Equipment
  7.3 Continuity Monitoring Equipment
8 PROCEDURE
  8.1 Component Sample
  8.2 Test Board Material
  8.3 Test Board Thickness and Metal Layer
  8.4 Test Board Surface Finish
  8.5 Test Board Land Pads
  8.6 Test Board Layout
  8.7 Test Board Daisy-Chain Links
  8.8 Board Assembly
  8.9 Storage
  8.10 Strain Gages
  8.11 Set-Up Test Board
  8.12 Four-Point Bend Test
9 FAILURE CRITERIA AND ANALYSIS
ANNEX A
ANNEX B

Describes a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations.

DevelopmentNote	Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese langugae, See IPC 9702 CHINESE. (09/2011) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 9703 : 0

IPC 9704 CHINESE : -	PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
IPC 9707 : 0	SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
IPC 9709 : 0	TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9701 CHINESE : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9704 : A	PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

IPC 9501 : 0	PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS