Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

16-06-2000

Publisher

International Electrotechnical Committee

FOREWORD
PREFACE
PHILOSOPHY OF MECHANICAL STANDARDIZATION
RECOMMENDED VALUES FOR CERTAIN DIMENSIONS OF DRAWINGS OF
SEMI-CONDUCTOR DEVICES
DEVICE OUTLINE DRAWINGS
TYPES OF SEMICONDUCTOR DEVICES GENERALLY MOUNTED IN THE
PACKAGES OF CHAPTER I
BASE DRAWINGS
CASE OUTLINE DRAWINGS
GAUGE DRAWINGS
TABLES SHOWING ASSOCIATIONS BETWEEN CASE OUTLINES AND BASES
OBSOLETE DRAWINGS
ADDITIONS TO THE LIST OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2

DevelopmentNote	Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	48
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NEN IEC 60191-2Y : 2000	Identical

IEC 60191-6-6:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)