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IEC 60191-2V:1998

Current

Current

The latest, up-to-date edition.

Twentieth supplement

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

22-12-1998

Contents
Foreword
Preface
Chapter OO - Philosophy of Mechanical Standardization
Chapter O - Recommended Values for Certain Dimensions of
Drawings of Semiconductor Devices
Chapter I - Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter 1
Chapter II - Base Drawings
Chapter III - Case Outline Drawings
Chapter IV - Gauge Drawings
Chapter V - Tables Showing Associations Between Case
Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on
the Standard Sheets of IEC Publication 191-2
Deletions to the Lists of National Codes Appearing on the
Standard Sheets of IEC Publication 191-2

Incorporated into main document IEC 60191 PT2.

DevelopmentNote
This standard is part of the Consolidated edition IEC 60191 PT2 1966 but can be purchased separately. Stability Date: 2020. (07/2015)
DocumentType
Standard
Pages
23
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NEN IEC 60191-2V : 1999 Identical

IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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$75.38
Including GST where applicable

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