PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS

Published date

15-04-2012

Publisher

Defense Supply Centre Columbus

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES

Specifies the requirements for a type 4 rigid multilayer printed wiring board to be used for qualifying to DoD printed board specifications.

Committee	FSC 5998
DocumentType	Standard
PublisherName	Defense Supply Centre Columbus
Status	Current

IPC J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
DSCC 10012 : 0	PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 2220 : LATEST	IPC 2220 FAMILY OF DESIGN DOCUMENTS
MIL-STD-130 Revision N:2007	IDENTIFICATION MARKING OF U.S. MILITARY PROPERTY
IPC 9252 : A	REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
MIL-PRF-55110 Revision H:2014	Printed Wiring Board, Rigid, General Specification for
IPC D 325 : A	DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC 2615 : 0	PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC 2511 : B	GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2222 : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC OI 645 : 0	STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
IPC D 350 : 0	PRINTED BOARD DESCRIPTION IN DIGITAL FORM
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS

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Features

DSCC 10014:2012