MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) - Normative references to
international publications with their corresponding
European publications

Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-1006. (07/2015)
DocumentType	Standard
Pages	20
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 60191-6-6:2001	Identical
EN 60191-6-6:2001	Identical

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CEI EN 60191-6-6 : 2002

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)

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Abstract

General Product Information

International Equivalents

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